资源名称:  Introduction to Microsystem Packaging Technology

  • 【资源类型】  科技成果>>著作
  • 【服务单位】  北京市海淀区北京大学微纳电子大厦
  • 【通讯地址】  北京大学
  • 【联系方式】  010-62752536
  • 【资源描述】  With the development of informatization, IC has stepped into the age of system on chip(SOC).SOC refers to the integration of processing, transimission and storage functions into a chip,which might be called integrated microsystem in a narrow sense. Far beyond the domain of the electronis system, the microsystem in a broad sense is an emerging technological subject integrating microelectronics, precision mechanics, optoelectronics, and even biomedicine and hydrodynamics.Introduction to Microsystem Packaging Technology involves various techologies in relation to microsystem packaging including packaging design, film material and techniqes, substrate, interconnect, encapsulation and sealing, device level package, MEMS packaging, modular assembly and optoelectronics packaging, system-in-package(SIP),inspection, reliability design. This book can serve not only as teaching material and a reference book for graduates and senior undergraduates but also as a reference book for teachers and engineering technicians engaging in teaching and research in the field of MEMS.

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